NCP3063, NCP3063B, NCV3063
PIN DESCRIPTION
Pin No.
Pin Name
1
Switch Collector
2
Switch Emitter
3
Timing Capacitor
Oscillator Input
4
GND
5
Comparator
Inverting Input
6
VCC
7
Ipk Sense
8
Exposed
Pad
N.C.
Exposed Pad
Internal Darlington switch collector
Internal Darlington switch emitter
Timing Capacitor
Description
Ground pin for all internal circuits
Inverting input pin of internal comparator
Voltage Supply
Peak Current Sense Input to monitor the voltage drop across an external resistor to limit the peak
current through the circuit
Pin Not Connected
The exposed pad beneath the package must be connected to GND (Pin 4). Additionally, using
proper layout techniques, the exposed pad can greatly enhance the power dissipation capabilities
of the NCP3063.
MAXIMUM RATINGS (measured vs. Pin 4, unless otherwise noted)
Rating
Symbol
Value
Unit
VCC pin 6
Comparator Inverting Input pin 5
Darlington Switch Collector pin 1
Darlington Switch Emitter pin 2 (transistor OFF)
Darlington Switch Collector to Emitter pin 1−2
Darlington Switch Current
Ipk Sense Pin 7
Timing Capacitor Pin 3
POWER DISSIPATION AND THERMAL CHARACTERISTICS
VCC
0 to +40
V
VCII
−0.2 to + VCC
V
VSWC
0 to +40
V
VSWE
−0.6 to + VCC
V
VSWCE
0 to +40
V
ISW
1.5
A
VIPK
−0.2 to VCC + 0.2
V
VTCAP
−0.2 to +1.4
V
Rating
Symbol
Value
Unit
PDIP−8
Thermal Resistance, Junction−to−Air
SOIC−8
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
DFN−8
Thermal Resistance, Junction−to−Air
Storage Temperature Range
Maximum Junction Temperature
Operating Junction Temperature Range (Note 3)
NCP3063
NCP3063B, NCV3063
RqJA
RqJA
RqJC
RqJA
TSTG
TJ MAX
TJ
100
180
45
80
−65 to +150
+150
0 to +70
−40 to +125
°C/W
°C/W
°C/W
°C
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Pin 1−8: Human Body Model 2000 V per AEC Q100−002; 003 or JESD22/A114; A115
Machine Model Method 200 V
2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78.
3. The relation between junction temperature, ambient temperature and Total Power dissipated in IC is TJ = TA + Rq • PD
4. The pins which are not defined may not be loaded by external signals
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