NCP3064PG View Datasheet(PDF) - ON Semiconductor

Part Name

Description

MFG CO.

NCP3064PG

Inverting Converter, Switching Regulator - Buck Boost, ON/OFF Function 1.5 A

ON Semiconductor 

NCP3064, NCP3064B, NCV3064

MAXIMUM RATINGS (measured vs. Pin 4, unless otherwise noted)

RATING

SYMBOL

VALUE

UNIT

VCC (Pin 6)

Comparator Inverting Input (Pin 5)

Darlington Switch Emitter (Pin 2) (Transistor OFF)

Darlington Switch Collector (Pin 1)

Darlington Switch Collector to Emitter (Pins 1 and 2)

Darlington Switch Peak Current

Ipk Sense Voltage (Pin 7)

Timing Capacitor Pin Voltage (Pin 3)

Moisture Sensitivity Level

VCC

VCII

VSWE

VSWC

VSWCE

ISW

VIPK

VTC

MSL

−0.3 to 42

V

−0.3 to VCC

V

−0.6 to VCC

V

−0.3 to 42

V

−0.3 to 42

V

1.5

A

−0.3 to (VCC + 0.3 V)

V

−0.2 to +1.4

V

1

Lead Temperature Soldering

Reflow (SMD Styles Only), Pb−Free Versions

TSLD

°C

260

ON/OFF Pin Voltage

VON/OFF

(−0.3 to 25) < VCC

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

THERMAL CHARACTERISTIC

Rating

Symbol

Value

PDIP−8 (Note 5) Thermal Resistance Junction−to−Air

RqJA

100

SOIC−8 (Note 5)

Thermal Resistance Junction−to−Air

RqJA

180

Thermal Resistance Junction−to−Case

RqJC

45

DFN−8 (Note 5)

Thermal Resistance Junction−to−Air

Thermal Resistance Junction−to−Case

Storage temperature range

Maximum junction temperature

Operation Junction Temperature Range (Note 3)

NCP3064

NCP3064B, NCV3064

RqJA

RqJC

TSTG

TJ MAX

TJ

78

14

−65 to +150

+150

0 to +70

−40 to +125

1. This device series contains ESD protection and exceeds the following tests:

Pins 1 through 8:

Human Body Model 2000 V per AEC Q100−002; 003 or JESD22/A114; A115

Machine Model Method 200 V

2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78.

3. The relation between junction temperature, ambient temperature and Total Power dissipated in IC is TJ = TA + RQ @ PD.

4. The pins which are not defined may not be loaded by external signals.

5. 1 oz copper, 1 in2 copper area.

Unit

°C/W

°C/W

°C/W

°C

°C

°C

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