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MSM64162 View Datasheet(PDF) - Oki Electric Industry

Part Name
Description
MFG CO.
MSM64162 Datasheet PDF : 39 Pages
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¡ Semiconductor
PAD CONFIGURATION
Pad Layout
50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
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Chip Size
Chip Thickness
Coordinate Origin
Pad Hole Size
Pad Size
Minimum Pad Pitch
: 4.69 mm ¥ 4.41 mm
: 350 mm (typ.)
: Chip center
: 110 mm ¥ 110 mm
: 130 mm ¥ 130 mm
: 180 mm
Note: The chip substrate voltage is VDD.
MSM64162
y
x
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