Physical Dimensions
19.56
18.80
14
1
8
6.60
6.09
7
(1.74)
3.56
3.30
1.77
1.14
5.33 MAX
3.81
3.17
0.38 MIN
0.58
0.35
2.54
NOTES: UNLESS OTHERWISE SPECIFIED
THIS PACKAGE CONFORMS TO
A) JEDEC MS-001 VARIATION BA
B) ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONS ARE EXCLUSIVE OF BURRS,
C) MOLD FLASH, AND TIE BAR EXTRUSIONS.
D) DIMENSIONS AND TOLERANCES PER
ASME Y14.5-1994
E) DRAWING FILE NAME: MKT-N14AREV7
8.12
7.62
0.35
0.20
8.82
Figure 8. 14-Lead, Plastic Dual-Inline Package (PDIP), JEDEC MS-001, 0.300in Wide
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without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 1983 Fairchild Semiconductor Corporation
MM74HCT14 • Rev. 1.4.2
10
www.fairchildsemi.com