MCP3909T(2006) View Datasheet(PDF) - Microchip Technology
Part Name
Description
MFG CO.
MCP3909T
(Rev.:2006)
(Rev.:2006)
Microchip Technology
MCP3909T Datasheet PDF : 40 Pages
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MCP3909
24-Lead Plastic Shrink Small Outline (SS) (SSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
p
E1
B
n
D
2
1
A
c
φ
A2
A1
L
Units
INCHES
MILLIMETERS*
Number of Pins
Pitch
Dimension Limits
n
p
MIN
NOM
24
.026 BSC.
MAX
MIN
NOM
24
0.65 BSC.
MAX
Overall Height
A
.068
.073
.078
1.73
1.86
1.99
Molded Package Thickness
A2
.066
.068
.070
1.68
1.73
1.78
Standoff
A1
.002
.005
.008
0.05
0.13
0.21
Overall Width
E
.301
.307
.311
7.65
7.80
7.90
Molded Package Width
E1
.205
.209
.212
5.20
5.30
5.38
Overall Length
D
.318
.323
.328
8.07
8.20
8.33
Foot Length
Lead Thickness
Foot Angle
L
.025
.030
.037
0.63
0.75
0.95
c
.004
.006
–
0.09
0.15
–
φ
0°
4°
8°
0°
4°
8°
Lead Width
B
.010
–
.015
0.25
–
0.38
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed.010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
JEDEC Equivalent: MO-150
Drawing No. C04-132
Revised 9-14-05
DS22025A-page 34
© 2006 Microchip Technology Inc.
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