CXD1170 View Datasheet(PDF) - Sony Semiconductor

Part Name

Description

MFG CO.

CXD1170

6-bit 40MSPS High Speed D/A Converter

Sony Semiconductor 

Package Outline

Unit: mm

24PIN SOP (PLASTIC)

+ 0.4

15.0 – 0.1

24

13

CXD1170M

+ 0.4

1.85 – 0.15

0.15

+ 0.2

0.1 – 0.05

1

0.45 ± 0.1

12

1.27

+ 0.1

0.2 – 0.05

± 0.12 M

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-24P-L01

∗SOP024-P-0300-A

PACKAGE STRUCTURE

MOLDING COMPOUND EPOXY/PHENOL RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER ALLOY / 42ALLOY

PACKAGE WEIGHT

0.3g

–8–

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