MC74HC1G32DFT1G View Datasheet(PDF) - ON Semiconductor
Part Name
Description
MFG CO.
MC74HC1G32DFT1G Datasheet PDF : 9 Pages
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MC74HC1G32
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
SC−88A (NLV), TSOP−5
−0.5 to +7.0
V
SC−88A, SC−74A
−0.5 to +6.5
VIN
VOUT
IIK
IOK
IOUT
ICC or IGND
TSTG
TL
TJ
qJA
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Source/Sink Current
DC Supply Current per Supply Pin or Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance (Note 1)
SC70−5/SC−88A/SOT−353
SOT23−5/TSOP−5/SC59−5
SC−74A
−0.5 to VCC +0.5
−0.5 to VCC +0.5
±20
±20
±12.5
±25
−65 to +150
260
+150
659
555
555
V
V
mA
mA
mA
mA
°C
°C
°C
°C/W
PD
Power Dissipation in Still Air at 85°C
SC70−5/SC−88A/SOT−353
190
mW
SOT23−5/TSOP−5/SC59−5
225
SC−74A
225
MSL
Moisture Sensitivity
Level 1
FR
VESD
Flammability Rating
ESD Withstand Voltage (Note 2)
Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Human Body Model
2000
V
Charged Device Model
1000
ILATCHUP Latchup Performance (Note 3)
SC−88A (NLV), SOT−23
±500
mA
SC−88A, SC−74A
±100
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 20 ounce copper trace with no air flow.
2. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to JESD22−C101−F. JEDEC recommends that ESD qualification to
EIA/JESD22−A115A (Machine Model) be discontinued per JEDEC/JEP172A.
3. Tested to EIA/JESD78 Class II.
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