MAX5802AAUBT(2012) View Datasheet(PDF) - Maxim Integrated

Part Name

Description

MFG CO.

MAX5802AAUBT
(Rev.:2012)

Ultra-Small, Dual-Channel, 8-/10-/12-Bit Buffered Output DACs with Internal Reference and I2C Interface

Maxim Integrated 

MAX5800/MAX5801/MAX5802

Ultra-Small, Dual-Channel, 8-/10-/12-Bit Buffered Output

DACs with Internal Reference and I2C Interface

ABSOLUTE MAXIMUM RATINGS

VDD, VDDIO to GND................................................. -0.3V to +6V

OUT_, REF to GND..................................... -0.3V to the lower of

(VDD + 0.3V) and +6V

SCL, SDA, CLR to GND........................................... -0.3V to +6V

ADDR to GND..............................................-0.3V to the lower of

(VDDIO + 0.3V) and +6V

Continuous Power Dissipation (TA = +70NC)

µMAX (derate at 8.8mW/NC above 70NC).....................707mW

TDFN (derate at 24.4mW/NC above 70NC).................1951mW

Maximum Continuous Current into Any Pin..................... Q50mA

Operating Temperature Range......................... -40NC to +125NC

Storage Temperature Range............................. -65NC to +150NC

Lead Temperature (soldering, 10s).................................+300NC

Soldering Temperature (reflow)..................................... +260NC

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

µMAX

TDFN

Junction-to-Ambient Thermal Resistance (θJA) ........113NC/W

Junction-to-Case Thermal Resistance (θJC) ...............42NC/W

Junction-to-Ambient Thermal Resistance (θJA)...........41NC/W

Junction-to-Case Thermal Resistance (θJC) .................9NC/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

ELECTRICAL CHARACTERISTICS

(VDD = 2.7V to 5.5V, VDDIO = 1.8V to 5.5V, VGND = 0V, CL = 200pF, RL = 2kI, TA = -40NC to +125NC, unless otherwise noted. Typical

values are at TA = +25NC.) (Note 2)

PARAMETER

DC PERFORMANCE (Note 3)

Resolution and Monotonicity

Integral Nonlinearity (Note 4)

Differential Nonlinearity (Note 4)

Offset Error (Note 5)

Offset Error Drift

Gain Error (Note 5)

SYMBOL

N

INL

DNL

OE

MAX5800

MAX5801

MAX5802

MAX5800

MAX5801

MAX5802

MAX5800

MAX5801

MAX5802

GE

CONDITIONS

Gain Temperature Coefficient

Zero-Scale Error

Full-Scale Error

With respect to VREF

With respect to VREF

MIN TYP MAX UNITS

8

10

12

-0.25

-0.5

-1

-0.25

-0.5

-1

-5

-1.0

0

-0.5

Q0.05

Q0.25

Q0. 5

Q0.05

Q0.1

Q0.2

Q0.5

Q10

Q0.1

Q3.0

+0.25

+0.5

+1

+0.25

+0.5

+1

+5

+1.0

10

+0.5

Bits

LSB

LSB

mV

FV/NC

%FS

ppm of

FS/NC

mV

%FS

Maxim Integrated

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