M24C16, M24C08, M24C04, M24C02, M24C01
REVISION HISTORY
Table 24. Document Revision History
Date
Rev.
Description of Revision
10-Dec-1999
2.4
TSSOP8 Turned-Die package removed (p 2 and order information)
Lead temperature added for TSSOP8 in table 2
18-Apr-2000 2.5 Labelling change to Fig-2D, correction of values for ‘E’ and main caption for Tab-13
05-May-2000 2.6 Extra labelling to Fig-2D
23-Nov-2000
3.0
SBGA package information removed to an annex document
-R range changed to being the -S range, and the new -R range added
19-Feb-2001
SBGA package information put back in this document
Lead Soldering Temperature in the Absolute Maximum Ratings table amended
3.1 Write Cycle Polling Flow Chart using ACK illustration updated
References to PSDIP changed to PDIP and Package Mechanical data updated
Wording brought in to line with standard glossary
20-Apr-2001 3.2 Revision of DC and AC characteristics for the -S series
08-Oct-2001 3.3 Ball numbers added to the SBGA connections and package mechanical illustrations
09-Nov-2001 3.4 Specification of Test Condition for Leakage Currents in the DC Characteristics table improved
30-Jul-2002
3.5
Document reformatted using new template. SBGA5 package removed
TSSOP8 (3x3mm² body size) package (MSOP8) added. -L voltage range added
04-Feb-2003 3.6 Document title spelt out more fully. “W”-marked devices with tw=5ms added.
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