LX1672-05CPW View Datasheet(PDF) - Microsemi Corporation
Part Name
Description
MFG CO.
LX1672-05CPW Datasheet PDF : 20 Pages
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LX1672
®
Multiple Output LoadSHARE™ PWM
TM
PRELIMINARY DATA SHEET
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VCC) DC .................................................................-0.3V to 5.5V
Supply Voltage (VCC) Transient ......................................................-0.3V to 6.0V
Driver Supply Voltage (VCx, VCCL) DC ............................................-0.3V to 16V
Driver Supply Voltage (VCx, VCCL) Transient ..................................-0.3V to 18V
Current Sense Inputs (VSX, CSX) ....................................................... -0.3V to 12V
Error Amplifier Inputs (FBX, RF2)....................................................-0.3V to 5.5V
Input Voltage (SS/SHDN) ..................................................................-0.3V to5.5V
Output Drive Peak Current Source (HOx, LOx)....................................1A (500ns)
Output Drive Peak Current Sink (HOx, LOx) .......................................1A (500ns)
Operating Junction Temperature.................................................................. 150°C
Storage Temperature Range...........................................................-65°C to 150°C
RoHS Peak Package Solder Reflow Temperature
(40 second maximum exposure) ..................................................... 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of specified
terminal.
The limitation on transient time is thermal and is due to zener diodes on the
supply pins, brief application of maximum voltages will increase current into that
pin and increase package power dissipation..
x= Denote Phases 1 & 2
THERMAL DATA
PW Plastic TSSOP 28-Pin
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
85°C/W
LQ Plastic MLPQ 38-Pin
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
35°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJC).
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
PACKAGE PIN OUT
HO2
LO2
PG2
LDGD
LDFB
LDDIS
DGND
AGND
DIS2
SS2
RF2
FB2
EO2
CS2
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
PW PACKAGE
(Top View)
VC2
VC1
HO1
LO1
PG1
VCCL
VCC
VS1
CS1
EO1
FB1
SS1
DIS1
VS2
HO2
VC2
LDGD
LDFB
LDDIS
DGND
AGND
RSVD
SS2
RF2
FB2
EO2
1 38 37 36 35 34 33 32 31
2
30
3
29
4
28
5
27
6 Connect Bottom to 26
Power GND
7
25
8
24
9
23
10
22
11
21
12 13 14 15 16 17 18 19 20
N.C.
N.C.
VCCL
VCC
DIS2
DIS1
N.C.
N.C.
PWGD
N.C.
N.C.
N.C.
(N.C. – No Internal Connection
N/U – Not Used)
RoHS / Pb-free 100% Matte Tin Lead Finish
Copyright © 2000
Rev. 0.3m, 2005-04-12
Microsemi
Linfinity Microelectronics Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
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