LTM4613 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
LTM4613 Datasheet PDF : 30 Pages
| |||
LTM4613
APPLICATIONS INFORMATION
Table 3. 12V and 15V Outputs
DERATING CURVE
Figures 13, 15
VIN (V)
24, 36
Figures 13, 15
24, 36
Figures 13, 15
24, 36
Figures 14, 16
24, 36
Figures 14, 16
24, 36
Figures 14, 16
24, 36
POWER LOSS CURVE
Figure 9
Figure 9
Figure 9
Figure 9
Figure 9
Figure 9
AIRFLOW (LFM)
0
200
400
0
200
400
HEAT SINK
None
None
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
θJA (°C/W)
10
8
7
9.5
6.5
6.5
Table 4. 5V Output
DERATING CURVE
Figure 11
Figure 11
Figure 11
Figure 12
Figure 12
Figure 12
VIN (V)
36
36
36
36
36
36
POWER LOSS CURVE
Figure 10
Figure 10
Figure 10
Figure 10
Figure 10
Figure 10
AIRFLOW (LFM)
0
200
400
0
200
400
HEAT SINK
None
None
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
Table 5. Heat Sink Manufacturers
HEAT SINK MANUFACTURER
AAVID Thermalloy
Cool Innovations
PART NUMBER
375424B00034G
4-050503P to 4-050508P
WEBSITE
www.aavidthermalloy.com
www.coolinnovations.com
θJA (°C/W)
8.5
6.5
6.5
8
6
6
Layout Checklist/Example
The high integration of LTM4613 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout consid-
erations are still necessary.
• Use large PCB copper areas for high current path, in-
cluding VIN, PGND and VOUT. It helps to minimize the
PCB conduction loss and thermal stress.
• Place high frequency ceramic input and output capaci-
tors next to the VD, PGND and VOUT pins to minimize
high frequency noise.
• Place a dedicated power ground layer underneath the
unit.
• Use round corners for the PCB copper layer to minimize
the radiated noise.
• To minimize the EMI noise and reduce module thermal
stress, use multiple vias for interconnection between
top layer and other power layers.
• Do not put vias directly on pads.
• If vias are placed onto the pads, the the vias must be
capped.
• Interstitial via placement can also be used if necessary.
• Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
• Place one or more high frequency ceramic capacitors
close to the connection into the system board.
Figure 17 gives a good example of the recommended layout.
20
For more information www.linear.com/LTM4613
4613fd
Share Link: 