LTC2240I-12 View Datasheet(PDF) - Linear Technology

Part Name

Description

MFG CO.

LTC2240I-12

12-Bit, 170Msps ADC

Linear Technology 

LTC2240-12

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

UP Package

64-Lead Plastic QFN (9mm × 9mm)

(Reference LTC DWG # 05-08-1705 Rev C)

0.70 ±0.05

7.15 ±0.05

7.50 REF

(4 SIDES)

8.10 ±0.05 9.50 ±0.05

7.15 ±0.05

0.25 ±0.05

0.50 BSC

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

9 .00 ± 0.10

(4 SIDES)

PIN 1 TOP MARK

(SEE NOTE 5)

PACKAGE OUTLINE

0.75 ± 0.05

R = 0.10

TYP

7.50 REF

(4-SIDES)

R = 0.115

TYP

7.15 ± 0.10

63 64

PIN 1

CHAMFER

C = 0.35

0.40 ± 0.10

1

2

7.15 ± 0.10

0.200 REF

0.00 – 0.05

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5

2. ALL DIMENSIONS ARE IN MILLIMETERS

3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT

4. EXPOSED PAD SHALL BE SOLDER PLATED

5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

6. DRAWING NOT TO SCALE

28

(UP64) QFN 0406 REV C

0.25 ± 0.05

0.50 BSC

BOTTOM VIEW—EXPOSED PAD

224012fd

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