LTC2239 View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
LTC2239 Datasheet PDF : 24 Pages
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PACKAGE DESCRIPTIO
UH Package
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1693)
5.50 ±0.05
4.10 ±0.05
3.45 ±0.05
(4 SIDES)
0.70 ±0.05
LTC2239
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
5.00 ± 0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
PACKAGE OUTLINE
0.75 ± 0.05
0.00 – 0.05
3.45 ± 0.10
(4-SIDES)
BOTTOM VIEW—EXPOSED PAD
0.23 TYP
R = 0.115
(4 SIDES)
TYP
31 32
0.40 ± 0.10
1
2
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.200 REF
0.25 ± 0.05
0.50 BSC
(UH) QFN 0603
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
2239fa
23
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