LT3517
PACKAGE DESCRIPTION
UF Package
16-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1692)
4.35 p 0.05
2.15 p 0.05
2.90 p 0.05 (4 SIDES)
0.72 p 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (W
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON A
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PACKAGE OUTLINE
0.30 p 0.05
0.65 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
4.00 p 0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 p 0.05
2.15 p 0.10
(4-SIDES)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
15 16
PIN 1 NOTCH R = 0.20 TYP
OR 0.35 s 45o CHAMFER
0.55 p 0.20
1
2
0.200 REF
0.00 – 0.05
(UF16) QFN 1004
0.30 p 0.05
0.65 BSC
3517fa
18