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LT3492IUFD-TRPBF View Datasheet(PDF) - Linear Technology

Part Name
Description
MFG CO.
LT3492IUFD-TRPBF
Linear
Linear Technology 
LT3492IUFD-TRPBF Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
LT3492
PACKAGE DESCRIPTION
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation EB
4.75
(.187)
9.60 – 9.80*
(.378 – .386)
4.75
(.187)
28 2726 25 24 23 22 21 20 19 18 1716 15
6.60 p0.10
4.50 p0.10
SEE NOTE 4
2.74
(.108)
0.45 p0.05
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
1.05 p0.10
2.74
(.108)
6.40
(.252
BSC
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0o – 8o
1 2 3 4 5 6 7 8 9 10 11 12 13 14
1.20
(.047)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
0.05 – 0.15
(.002 – .006)
FE28 (EB) TSSOP 0204
3492f
18

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