LT3014B View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
LT3014B Datasheet PDF : 12 Pages
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PACKAGE DESCRIPTIO
0.62
0.95
MAX
REF
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
1.22 REF
2.90 BSC
(NOTE 4)
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC
1.50 – 1.75
(NOTE 4)
LT3014B
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
PIN ONE
0.95 BSC
0.80 – 0.90
1.00 MAX
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
0.01 – 0.10
0.30 – 0.50 REF
0.09 – 0.20
NOTE:
(NOTE 3)
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ±0.05
1.90 BSC
S5 TSOT-23 0302
R = 0.115
TYP
5
0.38 ± 0.10
8
3.5 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
4
0.25 ± 0.05
(DD8) DFN 1203
1
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3014bf
11
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