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LM2901N View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
LM2901N
ST-Microelectronics
STMicroelectronics 
LM2901N Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
LM2901
5
Package information
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
5.1
DIP14 package information
Figure 21. DIP14 package mechanical drawing
Table 4.
Ref.
a1
B
b
b1
D
E
e
e3
F
I
L
Z
DIP14 package mechanical data
Dimensions
Millimeters
Min.
0.51
1.39
1.27
Typ.
0.5
0.25
8.5
2.54
15.24
3.3
Max.
1.65
20
7.1
5.1
2.54
Min.
0.020
0.055
0.050
Inches
Typ.
0.020
0.010
0.335
0.100
0.600
0.130
Max.
0.065
0.787
0.280
0.201
0.100
9/13

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