5962F9666302QEC View Datasheet(PDF) - Intersil
Part Name
Description
MFG CO.
5962F9666302QEC Datasheet PDF : 3 Pages
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HS-26CLV31RH, HS-26CLV31EH
Die Characteristics
DIE DIMENSIONS:
96.5 mil x 195 mils x 21 mils
(2450 x 4950)
INTERFACE MATERIALS:
Glassivation:
Type: PSG (Phosphorus Silicon Glass)
Thickness: 8kÅ ±1kÅ
Metallization:
Bottom: Mo/TiW
Thickness: 5800Å ±1kÅ
Top: AlSiCu (Top)
Thickness: 10kÅ ±1kÅ
Metallization Mask Layout
HS-26CLV31RH, HS-26CLV31EH
AO (2)
AO (3)
ENABLE (4)
BO (5)
BO (6)
(14) DO
(13) DO
(12) ENABLE
(11) CO
(10) CO
Substrate:
AVLSI1RA
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
VDD
ADDITIONAL INFORMATION:
Worst Case Current Density:
<2.0 x 105A/cm2
Bond Pad Size:
110µm x 100µm
TABLE 1. HS-26CLV31RH, HS-26CLV31EH PAD COORDINATES
RELATIVE TO PIN 1
PIN
NUMBER
PAD
NAME
X COORDINATES Y COORDINATES
1
AIN
0
0
2
A0
0
-570.7
3
A0
0
-1483.5
4
ENABLE
0
-2124.8
5
B0
0
-2873.5
6
B0
0
-3786.3
7
BIN
0
-4357
8
GND
852.4
-4357
8
GND
1062.4
-4357
9
CIN
1912.8
-4357
10
C0
1912.8
-3786.3
11
C0
1912.8
-2873.5
12
ENABLE
1912.8
-2124.8
13
D0
1912.8
-1483.5
14
D0
1912.8
-570.7
15
DIN
1912.8
0
16
VIN
1062.4
0
16
VIN
852.4
0
NOTE: Dimensions in microns
3
FN4898.3
December 12, 2012
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