HIP6013 View Datasheet(PDF) - Intersil
Part Name
Description
MFG CO.
HIP6013 Datasheet PDF : 11 Pages
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HIP6013
4V
2V
0V
15A
10A
5A
0A
TIME (20ms/DIV)
FIGURE 4. OVER-CURRENT OPERATION
The over-current function will trip at a peak inductor current
(IPEAK) determined by:
IPEAK
=
I--O-----C----S----E----T-----•----R----O-----C----S----E----T--
rDS(ON)
where IOCSET is the internal OCSET current source (200µA
- typical). The OC trip point varies mainly due to the
MOSFET’s rDS(ON) variations. To avoid over-current tripping
in the normal operating load range, find the ROCSET resistor
from the equation above with:
1. The maximum rDS(ON) at the highest junction temperature.
2. The minimum IOCSET from the specification table.
3. Determine IPEAK for IPEAK > IOUT(MAX) + (∆I) ⁄ 2 ,
where ∆I is the output inductor ripple current.
For an equation for the ripple current see the section under
component guidelines titled ‘Output Inductor Selection’.
A small ceramic capacitor should be placed in parallel with
ROCSET to smooth the voltage across ROCSET in the
presence of switching noise on the input voltage.
Application Guidelines
Layout Considerations
As in any high frequency switching converter, layout is very
important. Switching current from one power device to another
can generate voltage transients across the impedances of the
interconnecting bond wires and circuit traces. These
interconnecting impedances should be minimized by using
wide, short printed circuit traces. The critical components
should be located as close together as possible using ground
plane construction or single point grounding.
HIP6013
UGATE
PHASE
VIN
Q1
LO
VOUT
D2
CIN
CO
RETURN
FIGURE 5. PRINTED CIRCUIT BOARD
POWER AND GROUND PLANES OR ISLANDS
Figure 5 shows the critical power components of the
converter. To minimize the voltage overshoot the
interconnecting wires indicated by heavy lines should be part
of ground or power plane in a printed circuit board. The
components shown in Figure 6 should be located as close
together as possible. Please note that the capacitors CIN
and CO each represent numerous physical capacitors.
Locate the HIP6013 within 3 inches of the MOSFETs, Q1.
The circuit traces for the MOSFETs’ gate and source
connections from the HIP6013 must be sized to handle up to
1A peak current.
Figure 6 shows the circuit traces that require additional
layout consideration. Use single point and ground plane
construction for the circuits shown. Minimize any leakage
current paths on the SS PIN and locate the capacitor, Css
close to the SS pin because the internal current source is
only 10µA. Provide local VCC decoupling between VCC and
GND pins. Locate the capacitor, CBOOT as close as practical
to the BOOT and PHASE pins.
+VIN
BOOT
D1
CBOOT
Q1 LO
HIP6013
PHASE
SS
VCC
+12V
D2 CO
VOUT
CSS
GND
CVCC
FIGURE 6. PRINTED CIRCUIT BOARD
SMALL SIGNAL LAYOUT GUIDELINES
6
4325.1
November 3, 2005
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