HEF4027BP View Datasheet(PDF) - NXP Semiconductors.

Part Name

Description

MFG CO.

HEF4027BP

Dual JK flip-flop

NXP Semiconductors. 

NXP Semiconductors

13. Package outline

DIP16: plastic dual in-line package; 16 leads (300 mil)

HEF4027B

Dual JK flip-flop

SOT38-4

D

L

Z

e

b

16

pin 1 index

A2 A

A1

wM

b1

b2

9

ME

c

(e 1)

MH

E

1

8

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

A

max.

A1

min.

A2

max.

b

b1

b2

c

D (1)

E (1)

e

e1

L

ME

MH

w

Z (1)

max.

mm

4.2

0.51

3.2

1.73

1.30

0.53

0.38

1.25

0.85

0.36 19.50 6.48

0.23 18.55 6.20

2.54

7.62

3.60

3.05

8.25

7.80

10.0

8.3

0.254

0.76

inches 0.17

0.02

0.13

0.068 0.021 0.049 0.014

0.051 0.015 0.033 0.009

0.77

0.73

0.26

0.24

0.1

0.3

0.14

0.12

0.32

0.31

0.39

0.33

0.01

0.03

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE

VERSION

IEC

SOT38-4

REFERENCES

JEDEC

JEITA

EUROPEAN

PROJECTION

ISSUE DATE

95-01-14

03-02-13

Fig 8. Package outline SOT38-4 (DIP16)

HEF4027B

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 9 — 18 November 2011

© NXP B.V. 2011. All rights reserved.

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