HCTS373D View Datasheet(PDF) - Intersil
Part Name
Description
MFG CO.
HCTS373D Datasheet PDF : 11 Pages
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HCTS373MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
D0
Q0
(3)
(2)
HCTS373MS
OE
VCC
Q7
(1)
(20)
(19)
D1 (4)
Q1 (5)
Q2 (6)
(18) D7
(17) D6
(16) Q6
(15) Q5
D2 (7)
(14) D5
(8)
(9)
D3
Q3
(10)
(11)
GND
LE
(12)
(13)
Q4
D4
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS373 is TA14403A.
Spec Number 518636
647
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