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EL5164IS-T7(2004) View Datasheet(PDF) - Intersil

Part Name
Description
MFG CO.
EL5164IS-T7
(Rev.:2004)
Intersil
Intersil 
EL5164IS-T7 Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
EL5164, EL5165, EL5364
Typical Performance Curves (Continued)
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.4
1.250W
SO16 (0.150”)
1.2
θJA=80°C/W
1
0.8 909mW
0.6
435mW
0.4
SO8
θJA=110°C/W
0.2
SOT23-5/6
θJA=230°C/W
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.4
1.2
1
0.8 893mW
0.6
QSOP16
θJA=112°C/W
0.4
0.2
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1
0.9
0.8
0.7
0.6 625mW
0.5
0.4
0.3 391mW
SO8
θJA=160°C/W
0.2
SOT23-5/6
0.1
θJA=256°C/W
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.2
1 1.136W
SO16 (0.150”)
θJA=110°C/W
0.8
633mW
0.6
0.4
QSOP16
0.2
θJA=158°C/W
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 22. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
8

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