EL5152, EL5153, EL5252, EL5455
Typical Performance Curves (Continued)
7
6
5
4
3
2
AV = +2
RL = 500Ω
1
CL = 5pF
0
±1 ±1.5 ±2 ±2.5 ±3 ±3.5 ±4 ±4.5 ±5
VOLTAGE (V)
FIGURE 23. SUPPLY CURRENT vs SUPPLY VOLTAGE
4
3
RL = 500Ω
CL = 0pF
2
1
±2.0V
0
±3.0V
±4.0V
-1
±5.0V
-2
-3
-4
-5
-6
100k
1M
10M
100M
FREQUENCY (Hz)
800M
FIGURE 24. FREQUENCY RESPONSE FOR VARIOUS
VOLTAGE SUPPLY LEVELS
5
4
AV = +1
RL = 500Ω
3 CL = 0pF
2
1
0
CHANNEL #1
-1
CHANNEL #2
-2
-3
-4
-5
100K
1M
10M
100M
1G
FREQUENCY (Hz)
FIGURE 25. EL5252 SMALL SIGNAL FREQUENCY - CHANNEL TO CHANNEL
JEDEC JESD51-7 HIGH EFFECTIVE
THERMAL CONDUCTIVITY TEST BOARD
1.4
SO14
1.2 1.136W
θJA = 88°C/W
1 909mW
0.9
0.8 870mW
0.6
SO8
θJA = 110°C/W
MSOP8/10
θJA = 115°C/W
0.4 435mW
0.2
SOT23-5/6
θJA = 230°C/W
0
0
25 50 75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 26. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE
THERMAL CONDUCTIVITY TEST BOARD
1
0.9
SO14
0.8 833mW
0.7
0.6 625mW
0.5
0.4 486mW
0.3 391mW
θJA = 120°C/W
SO8
θJA = 160°C/W
MSOP8/10
θJA = 206°C/W
0.2 SOT23-5/6
0.1 θJA = 256°C/W
0
0
25 50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 27. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
8
FN7385.6
March 2, 2009