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DS1672(2011) View Datasheet(PDF) - Maxim Integrated

Part Name
Description
MFG CO.
DS1672
(Rev.:2011)
MaximIC
Maxim Integrated 
DS1672 Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
PIN DESCRIPTION
DS1672
PIN
NAME
FUNCTION
Connections for Standard 32.768kHz Quartz Crystal. The internal oscillator
circuitry is designed for operation with a crystal having a specified load
capacitance (CL) of 6pF. For more information about crystal selection and
1, 2
X1, X2 crystal layout considerations, refer to Application Note 58: Crystal
Considerations with Dallas Real-Time Clocks. The DS1672 can also be driven
by an external 32.768kHz oscillator. In this configuration, the X1 pin is
connected to the external oscillator signal and the X2 pin is left unconnected.
Battery Input for Any Standard 3V Lithium Cell or Other Energy Source.
Battery voltage must be held between 1.3V and 3.63V for proper operation.
Diodes placed in series between the power source and the VBACKUP pin may
3
VBACKUP result in improper operation. If a backup supply is not required, VBACKUP must
be grounded. UL recognized to ensure against reverse charging current when
used in conjunction with a lithium battery (charger disabled). See “Conditions
of Acceptability” at www.maxim-ic.com/qa/info/ul.
4
GND Ground.
5
SDA
Serial-Data Input/Output. SDA is the input/output pin for the I2C serial
interface. The SDA pin is open drain and requires an external pullup resistor.
6
SCL
I2C Serial-Clock Input. SCL is used to synchronize data movement on the
serial interface and requires an external pullup resistor.
7
RST
Active-Low Reset Output. It functions as a microprocessor reset signal. This
pin is an open-drain output and requires an external pullup resistor.
Power pin for Primary Power Supply. When VCC is applied within normal
8
VCC limits, the device is fully accessible and data can be written and read. When
VCC is below VPF, reads and writes are inhibited.
Figure 3. Recommended Layout for Crystal
LOCAL GROUND PLANE (LAYER 2)
X1
CRYSTAL
X2
GND
7 of 15

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