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CXG1016N View Datasheet(PDF) - Sony Semiconductor

Part Name
Description
MFG CO.
CXG1016N
Sony
Sony Semiconductor 
CXG1016N Datasheet PDF : 4 Pages
1 2 3 4
Package Outline Unit : mm
3.0 ± 0.1
8PIN SSOP (PLASTIC)
85
A
+ 0.2
1.25 – 0.1
0.1
1
+ 0.08
0.24 – 0.07
B
4
0.65
0.13 M
0.25
0.1 ± 0.05
CXG1016N
+ 0.08
0.24 – 0.07
(0.22)
0° to 10°
DETAIL A
DETAIL B
NOTE: Dimension “” does not include mold protrusion.
SONY CODE
EIAJ CODE
JEDEC CODE
SSOP-8P-L01
SSOP008-P-0044
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER / PALLADIUM
PLATING
COPPER ALLOY
PACKAGE WEIGHT
0.04g
—4—

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