CD4585BMS View Datasheet(PDF) - Intersil
Part Name
Description
MFG CO.
CD4585BMS Datasheet PDF : 8 Pages
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CD4585BMS
Typical Performance Characteristics (Continued)
104 8
6
4
2
103 8
6
4
2
AMBIENT TEMPERATURE (TA) = +25oC
SUPPLY VOLTAGE (VDD) = 15V
102 8
6
4
2
10V
10V
10 8
6
4
2
5V
CL = 50pF
CL = 15pF
2 4 68 2 4 68 2 4 68 2 4 68 2 4 68
0.1
1
10
102
103
104
CLOCK INPUT FREQUENCY (fIN) (kHz)
FIGURE 8. TYPICAL DYNAMIC POWER DISSIPATION AS A FUNCTION OF CLOCK INPUT FREQUENCY
VDD
A0 A1 A2 A3
CD4585BMS
(A > B)IN
(A = B)IN
(A < B)IN
VDD
(A > B)OUT
(A = B)OUT
(A < B)OUT
A4 A5 A6 A7
CD4585BMS
VDD
A8 A9 A10 A11
CD4585BMS
B0 B1 B2 B3
B4 B5 B6 B7
B8 B9 B10 B11
tp TOTAL = tp (COMPARE) + 2 x tp (CASCADE) , AT VDD = 10V
INPUTS
INPUTS
FIGURE 9. TYPICAL SPEED CHARACTERISTICS OF A 12-BIT COMPARATOR
Chip Dimensions and Pad Layout
Dimensions in parenthese are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
7-1266
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