BUJ302AD View Datasheet(PDF) - Philips Electronics
Part Name
Description
MFG CO.
BUJ302AD Datasheet PDF : 14 Pages
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NXP Semiconductors
12. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1
General description . . . . . . . . . . . . . . . . . . . . . .1
1.2
Features and benefits . . . . . . . . . . . . . . . . . . . . .1
1.3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2
Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
3
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2
5
Thermal characteristics . . . . . . . . . . . . . . . . . . .5
6
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6
7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9
8
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11
10
Legal information. . . . . . . . . . . . . . . . . . . . . . . .12
10.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12
10.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
10.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
10.4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13
11
Contact information. . . . . . . . . . . . . . . . . . . . . .13
BUJ302AD
NPN power transistor
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 March 2011
Document identifier: BUJ302AD
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