AT45DB161
Packaging Information
32J, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-016 AE
28R, 28-Lead, 0.330" Wide, Plastic Gull Wing Small
Outline (SOIC)
Dimensions in Inches and (Millimeters)
.045(1.14) X 45° PIN NO. 1
IDENTIFY
.025(.635) X 30° - 45°
.012(.305)
.008(.203)
.032(.813)
.026(.660)
.553(14.0)
.547(13.9)
.595(15.1)
.585(14.9)
.530(13.5)
.490(12.4)
.021(.533)
.013(.330)
.050(1.27) TYP
.300(7.62) REF
.430(10.9)
.390(9.90)
AT CONTACT
POINTS
.030(.762)
.015(3.81)
.095(2.41)
.060(1.52)
.140(3.56)
.120(3.05)
.453(11.5)
.447(11.4)
.495(12.6)
.485(12.3)
.022(.559) X 45° MAX (3X)
28T, 28-Lead, Plastic Thin Small Outline Package
(TSOP)
Dimensions in Millimeters and (Inches)*
24C2, 24-Ball (5 x 5 array), 1.0mm Pitch, 7 x 9.5mm
Plastic Chip-scale Ball Grid Array (CBGA)
Dimensions in Millimeters and (Inches)*
7.2 (0.283)
6.8 (0.268)
9.7 (0.381)
9.3 (0.366)
*Controlling dimension: millimeters
1.62 (0.064)
1.36 (0.054)
1.40 (0.055) MAX
0.30 (0.012)
4.0 (0.157)
54 3 21
2.87 (0.113)
2.61 (0.103)
A
B
C
4.0 (0.157)
D
E
0.46 (0.018)
DIA BALL TYP
1.00 (0,039) BSC
NON-ACCUMULATIVE
*Controlling dimension: millimeters
20