AT25080B-XHL-B View Datasheet(PDF) - Atmel Corporation

Part Name

Description

MFG CO.

AT25080B-XHL-B

SPI Serial EEPROMs 8K (1,024 x 8) and 16K (2,048 x 8)

Atmel Corporation 

AT25080B/160B

AT25160B Ordering Information

Ordering Code

AT25160B-SSHL-B(1) (NiPdAu Lead Finish)

AT25160B-SSHL-T(2) (NiPdAu Lead Finish)

AT25160B-XHL-B(1) (NiPdAu Lead Finish)

AT25160B-XHL-T(2) (NiPdAu Lead Finish)

AT25160B-MAHL-T(2) (NiPdAu Lead Finish)

AT25160B-MEHL-T(2) (NiPdAu Lead Finish)

AT25160B-CUL-T(2) (SnAgCu Ball Finish)

Voltage

1.8V to 5.5V

1.8V to 5.5V

1.8V to 5.5V

1.8V to 5.5V

1.8V to 5.5V

1.8V to 5.5V

1.8V to 5.5V

Package

8S1

8S1

8A2

8A2

8MA2

8ME1

8U3-1

Operation Range

Lead-free/Halogen-free/

Industrial Temperature

(40 to 85C)

AT25160B-WWU11L(3)

1.8V to 5.5V Die Sale

Industrial Temperature

(40 to 85C)

Note:

1. Bulk delivery in tubes (SOIC and TSSOP 100/tube).

2. Tape and reel delivery (SOIC 4k/reel. TSSOP, UDFN, XDFN and VFBGA 5k/reel).

3. Contact Atmel Sales for Wafer sales.

8S1

8A2

8MA2

8ME1

8U3-1

Package Type

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin, Dual No Lead Package (UDFN)

8-lead (1.80 mm x 2.20 mm Body) Extra Thin DFN (XDFN)

8-ball, die Ball Grid Array Package (VFBGA)

19

5228D–SEEPR–4/10

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