AM29LV400BB-120 View Datasheet(PDF) - Advanced Micro Devices
Part Name
Description
MFG CO.
AM29LV400BB-120
Advanced Micro Devices
AM29LV400BB-120 Datasheet PDF : 14 Pages
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SUPPLEMENT
PAD DESCRIPTION
Pad locations relative to die center.
Pad Center (mils)
Pad Center (millimeters)
Pad
Signal
X
Y
X
Y
1
VCC
–0.90
80.50
–0.02
2.04
2
DQ4
–13.00
80.50
–0.33
2.04
3
DQ12
–18.90
80.50
–0.48
2.04
4
DQ5
–24.80
80.50
–0.63
2.04
5
DQ13
–30.70
80.50
–0.78
2.04
6
DQ6
–36.50
80.50
–0.93
2.04
7
DQ14
–42.40
80.50
–1.08
2.04
8
DQ7
–48.30
80.50
–1.23
2.04
9
DQ15/A–1
–54.20
80.50
–1.38
2.04
10
VSS
–63.60
78.90
–1.62
2.00
11
BYTE#
–63.60
68.90
–1.62
1.75
12
A16
–63.60
58.80
–1.62
1.49
13
A15
–63.30
–79.00
–1.61
–2.01
14
A14
–55.90
–79.00
–1.42
–2.01
15
A13
–50.50
–79.00
–1.28
–2.01
16
A12
–44.70
–79.00
–1.14
–2.01
17
A11
–39.30
–79.00
–1.00
–2.01
18
A10
–33.40
–79.00
–0.85
–2.01
19
A9
–28.00
–78.70
–0.71
–2.00
20
A8
–22.10
–79.00
–0.56
–2.01
21
WE#
–16.60
–79.00
–0.42
–2.01
22
RESET#
–7.10
–82.80
–0.18
–2.10
23
RY/BY#
10.20
–82.80
0.26
–2.10
24
A17
22.20
–79.00
0.56
–2.01
25
A7
28.00
–79.00
0.71
–2.01
26
A6
33.40
–79.00
0.85
–2.01
27
A5
39.30
–79.00
1.00
–2.01
28
A4
44.70
–79.00
1.14
–2.01
29
A3
50.50
–79.00
1.28
–2.01
30
A2
55.90
–79.00
1.42
–2.01
31
A1
63.30
–79.00
1.61
–2.01
32
A0
63.60
58.60
1.62
1.49
33
CE#
63.60
68.70
1.62
1.75
34
VSS
63.60
78.70
1.62
2.00
35
OE#
54.20
81.40
1.38
2.07
36
DQ0
46.60
80.50
1.18
2.04
37
DQ8
40.70
80.50
1.03
2.04
38
DQ1
34.90
80.50
0.89
2.04
39
DQ9
28.90
80.50
0.73
2.04
40
DQ2
23.10
80.50
0.59
2.04
41
DQ10
17.20
80.50
0.44
2.04
42
DQ3
11.40
80.50
0.29
2.04
43
DQ11
5.40
80.50
0.14
2.04
Note: The coordinates above are relative to die center and can be used to operate wire bonding equipment.
4
Am29LV400B Known Good Die
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