ADT7481
D1+ 2
D1– 3
D2+ 7
D2– 8
ON−CHIP TEMP
SENSOR
CONVERSION RATE
REGISTER
LOCAL TEMPERATURE
VALUE REGISTER
ANALOG
MUX
11−BIT A−TO−D
CONVERTER
BUSY RUN/STANDBY
REMOTE 1 AND 2 TEMP
VALUE REGISTERS
REMOTE 1 AND 2 TEMP
OFFSET REGISTERS
EXTERNAL DIODES OPEN−CIRCUIT
ADT7481
1
VDD
6
GND
STATUS REGISTERS
SMBUS INTERFACE
9
SDATA
10
SCLK
ADDRESS POINTER
REGISTER
ONE−SHOT
REGISTER
LOCAL TEMPERATURE
THERM LIMIT REGISTER
LOCAL TEMPERATURE
LOW LIMIT REGISTER
LOCAL TEMPERATURE
HIGH LIMIT REGISTER
REMOTE 1 AND 2 TEMP
THERM LIMIT REGISTER
REMOTE 1 AND 2 TEMP
LOW LIMIT REGISTERS
REMOTE 1 AND 2 TEMP
HIGH LIMIT REGISTERS
CONFIGURATION
REGISTERS
INTERRUPT
MASKING
4
THERM
Figure 1. Functional Block Diagram
8 ALERT/THERM2
ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Unit
Positive Supply Voltage (VDD) to GND
D+
D− to GND
−0.3 to +3.6
V
−0.3 to VDD + 0.3
V
−0.3 to +0.6
V
SCLK, SDATA, ALERT, THERM
−0.3 to +3.6
V
Input Current, SDATA, THERM
−1 to +50
mA
Input Current, D−
±1
mA
ESD Rating, All Pins (Human Body Model)
1500
V
Maximum Junction Temperature (TJ max)
Storage Temperature Range
150
°C
−65 to +150
°C
IR Reflow Peak Temperature
220
°C
IR Reflow Peak Temperature for Pb−Free
260
°C
Lead Temperature, Soldering (10 sec)
300
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
THERMAL CHARACTERISTICS
Package Type
10−Lead MSOP
qJA
qJC
142
43.74
Unit
°C/W
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