ADL5530
OUTLINE DIMENSIONS
Data Sheet
PIN 1 INDEX
AREA
0.80
0.75
0.70
SEATING
PLANE
3.25
3.00
2.75
TOP VIEW
0.30
0.23
0.18
2.25
2.00
1.75
1.89
0.55
1.74
0.40
1.59
0.30
5
8
0.60
0.45
0.30
EXPOSED PAD
4
1
BOTTOM VIEW
0.50 BSC
DETAIL A
(JEDEC 95)
0.20 MIN
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
0.05 MAX
0.02 NOM
0.203 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET
ORDERING GUIDE
Model1
ADL5530ACPZ-R7
ADL5530ACPZ-WP
ADL5530-EVALZ
1 Z = RoHS Compliant Part.
Figure 28. 8-Lead Lead Frame Chip Scale Package [LFCSP]
2 mm × 3 mm Body and 0.75 mm Package Height
(CP-8-23)
Dimensions shown in millimeters
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
8-Lead LFCSP, 7” Tape and Reel
8-Lead LFCSP, Waffle Pack
Evaluation Board
Package Option
CP-8-23
CP-8-23
Branding
OT
OT
Rev. C | Page 14 of 16