ADL5530-EVALZ View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
ADL5530-EVALZ Datasheet PDF : 16 Pages
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Data Sheet
THEORY OF OPERATION
The basic connections for operating the ADL5530 are shown in
Figure 22. Recommended components are listed in Table 5. The
inputs and outputs should be ac coupled with appropriately
sized capacitors (device characterization was performed with
10 nF capacitors). DC bias is provided to the amplifier via an
inductor connected to the RF output pin. The bias voltage
should be decoupled using a 10 nF capacitor.
A bias voltage of 5 V is recommended. However, the device is
specified to operate down to 3 V with a slightly reduced
compression point and a reduced noise figure.
RFIN
C1
10nF
3V TO 5V
1 NC
GND 8
2 IN1 OUT1 7
ADL5530
3 NC
NC 6
C5
10nF
L1
470nH
C2
10nF
RF OUT
4 NC
NC 5
NC = NO CONNECT
Figure 22. Basic Connections
For operation down to 10 MHz, a larger biasing choke is
recommended (see Table 5) along with larger ac-coupling
capacitors. Figure 23 shows a plot of input return loss and gain
with the recommended components.
Table 5. Recommended Components for Basic Connections
Frequency
C1
C2
L1
C5
10 MHz to 50 MHz 0.1 µF 0.1 µF 3.3 µH
0.1 µF
50 MHz to 1000 MHz 10 nF 10 nF 470 nH 10 nF
20
S21 (3.3µH)
15
S21 (470nH)
10
5
0
–5
S11 (470nH)
–10
S11 (3.3µH)
–15
–20
5
10 15 20 25 30 35 40 45 50
FREQUENCY (MHz)
Figure 23. Performance at 10 MHz
ADL5530
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 24 shows the recommended land pattern for ADL5530.
To minimize thermal impedance, the exposed paddle on the
package underside should be soldered down to a ground plane
along with Pin 8. If multiple ground layers exist, they should be
stitched together using vias. Pin 1, Pin 3, Pin 4, Pin 5 and Pin 6
can be left unconnected, or can be connected to ground.
Connecting these pins to ground slightly enhances thermal
impedance.
PIN 1
8
0.33mm
0.53mm
0.46mm
0.5mm
00..3333mmmm
4
5
2.13mm
Figure 24. Recommended Land Pattern
Rev. C | Page 11 of 16
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