AD8324(Rev0) View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
AD8324 Datasheet PDF : 16 Pages
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AD8324
OUTLINE DIMENSIONS
PIN 1
INDICATOR
4.0
BSC SQ
TOP
VIEW
3.75
BSC SQ
0.60
MAX
0.60
MAX
16
20
15
1
BOTTOM
VIEW
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.50
BSC
0.80 MAX
0.65 TYP
0.20
REF
0.75
0.55
0.35
0.05 MAX
0.02 NOM
11
5
10
6
0.30
0.23
0.18
COPLANARITY
0.08
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 30. 20-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body (CP-20)
Dimensions shown in millimeters
0.341
BSC
20
1
PIN 1
11
0.154
BSC
0.236
10
BSC
2.25
2.10 SQ
1.95
0.25 MIN
ORDERING GUIDE
Model
AD8324JRQ
AD8324JRQ-REEL
AD8324JRQ-REEL7
AD8324JRQ-EVAL
AD8324ACP
AD8324ACP-REEL7
AD8324ACP-EVAL
0.065
0.049
0.069
0.053
0.010
0.004
COPLANARITY
0.004
0.025
BSC
0.012
0.008
8°
SEATING
PLANE
0.010
0.006
0°
COMPLIANT TO JEDEC STANDARDS MO-137AD
0.050
0.016
Figure 31. 20-Lead Shrink Small Outline Package [QSOP] (RQ-20)
Dimensions shown in inches
Temperature Range
–25°C to +70°C
–25°C to +70°C
–25°C to +70°C
–40°C to +85°C
–40°C to +85°C
Package Description
20-Lead QSOP
20-Lead QSOP
20-Lead QSOP
Evaluation Board
20-Lead LFCSP
20-Lead LFCSP
Evaluation Board
θJA (°C/W)
83.21
83.21
83.21
30.42
30.42
1 Thermal resistance measured on SEMI standard 4-layer board.
2 Thermal resistance measured on SEMI standard 4-layer board, paddle soldered to board.
Package Option
RQ-20
RQ-20
RQ-20
CP-20
CP-20
© 2003 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C04339–0–10/03(0)
Rev. 0 | Page 16 of 16
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