ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
AVDD to AGND
DVDD to AGND
AGND to DGND
Analog Input Voltage to AGND
Reference Input Voltage to AGND
Digital Input Voltage to DGND
Digital Output Voltage to DGND
AIN/Digital Input Current
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Lead Temperature, Soldering
Reflow
Rating
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +0.3 V
−0.3 V to AVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
10 mA
−40°C to +105°C
−65°C to +150°C
150°C
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AD7192
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
24-Lead TSSOP
128
42
°C/W
ESD CAUTION
Rev. A | Page 9 of 40