Parameter
DYNAMIC PERFORMANCE, INHIBIT
Delay Time, Active to Inhibit
Delay Time, Inhibit to Active
I/O Spike
Output Capacitance
DYNAMIC PERFORMANCE, VTERM
Delay Time, Active to VTERM
Delay Time, VTERM to Active
Overshoot, Undershoot, and Preshoot
VTERM to VL or VH
Min Typ* Max Unit
1.5
0.7
<200
6
2.5 ns
1.7 ns
mV p-p
pF
0.50
1.30 ns
0.45
1.25 ns
± 6%/± 75
mV
POWER SUPPLIES
Total Supply Range
Positive Supply
Negative Supply
Positive Supply Current
Negative Supply Current
Total Power Dissipation
Temperature Sensor Gain Factor
15
V
9
V
–6
V
570 mA
570 mA
8.6 W
1.0
µA/K
NOTES
Connecting or shorting the decoupling capacitors to ground will result in the destruction of the device.
*Typical parameters are not production tested but guaranteed through characterization.
Specifications subject to change without notice.
Test Conditions
AD53513
Measured at 50%, VH = +2 V, VL = –2 V, VT = –2 V
Measured at 50%, VH = +2 V, VL = –2 V, VT = –2 V
VH = 0 V, VL = 0 V, VT = –2 V
Driver Inhibited
Measured at 50%, VH = +0.8 V, VL = –0.8 V, VT = 0 V
50 Ω Terminated
VL = –2 V, VH = +2 V, VT = 0 V
VL = –0.8 V, VH = +0.8 V, VT = 0 V
Output Terminated 50 Ω
RLOAD = 4.2 kΩ, VSOURCE = 9 V
ABSOLUTE MAXIMUM RATINGS1
Power Supply Voltage
+VS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 V
–VS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –7 V
+VS to –VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
Inputs
DATA, DATA, INH, INH, RLD, VBB . . . . . . . +5 V, –3 V
DATA to DATA, INH to INH, RLD, VBB . . . . . . . . . ± 3 V
VH, VL, VT to GND . . . . . . . . . . . . . . . . . . . . . . +7 V, –2 V
VH to VL (VH – VT) and (VT – VL) . . . . . . . . . . . . . . . . ± 9 V
Outputs
VOUT Short Circuit Duration . . . . . . . . . . . . . . . Indefinite2
VOUT Range in Inhibit Mode
VHDCPL . . . . . Do Not Connect Except for Capacitor to VCC
VLDCPL . . . . . Do Not Connect Except for Capacitor to VEE
THERM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 V, 0 V
Environmental
Operating Temperature (Junction) . . . . . . . . . . . . . . . 175°C
Storage Temperature . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 sec)3 . . . . . . . . . . . 260°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Absolute maximum limits apply
individually, not in combination. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
2Output short circuit protection is guaranteed as long as proper heat sinking is
employed to ensure compliance with the operating temperature limits.
3To ensure lead coplanarity (± 0.002 inches) and solderability, handling with bare
hands should be avoided and the device should be stored in environments at 24°C
± 5°C (75°F ± 10°F) with relative humidity not to exceed 65%.
Model
AD53513JSQ
ORDERING GUIDE
Package
Description
Shipment Method,
Quantity Per
Shipping Container
100-Lead LQFP-CDQUAD Tray, 90 Pieces
Package
Option
SQ-100
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD53513 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. 0
–3–