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74LVC3G07 View Datasheet(PDF) - Philips Electronics

Part Name
Description
MFG CO.
74LVC3G07
Philips
Philips Electronics 
74LVC3G07 Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Philips Semiconductors
74LVC3G07
Triple buffer with open-drain output
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
y
Z
8
5
pin 1 index
E
c
HE
A A2
A1
1
e
4
bp
wM
detail X
A
X
vM A
Q
(A3)
θ
Lp
L
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
mm
1
0.15
0.00
0.85
0.60
0.12
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
0.5
3.2
3.0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT765-1
REFERENCES
JEDEC
JEITA
MO-187
L
Lp
Q
v
w
y
Z(1)
θ
0.4
0.40 0.21
0.15 0.19
0.2
0.13
0.1
0.4
0.1
8°
0°
EUROPEAN
PROJECTION
ISSUE DATE
02-06-07
Fig 9. Package outline SOT765-1 (VSSOP8)
9397 750 14542
Product data sheet
Rev. 03 — 01 February 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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