NXP Semiconductors
CLF1G0035-100; CLF1G0035S-100
Broadband RF power GaN HEMT
,0'
G%F
DDD
I 0+]
VDS = 50 V; IDq = 500 mA; PL(PEP) = 20 W.
(1) f = 10 kHz
(2) f = 30 kHz
(3) f = 100 kHz
(4) f = 300 kHz
(5) f = 1 MHz
(6) f = 3 MHz
Fig 9. Third-order intermodulation distortion as a function of frequency and tone
spacing; typical values
7.4 Bias module
The bias module information for the GaN HEMT amplifier is described in application note
“AN11130”
8. Test information
8.1 Ruggedness in class-AB operation
The CLF1G0035-100 and CLF1G0035S-100 are capable of withstanding a load mismatch
corresponding to VSWR = 10 : 1 through all phases under the following conditions:
VDS = 50 V; PL = 100 W, f = 3000 MHz.
8.2 Load pull impedance information
The measured load pull impedances are shown below. Impedance reference plane
defined at device leads. Measurements performed with NXP test fixtures. Test
temperature set at 25 C with a pulsed CW signal; tp = 100 s; = 10 %; RF performance
at VDS = 50 V; IDq = 330 mA.
CLF1G0035-100_1G0035S-100
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 29 January 2013
© NXP B.V. 2013. All rights reserved.
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