S70WS512N00BAWAB3 View Datasheet(PDF) - Spansion Inc.
Part Name
Description
MFG CO.
S70WS512N00BAWAB3 Datasheet PDF : 93 Pages
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Advance Information
2 Ordering Information
The ordering part number is formed by a valid combination of the following:
S70WS 512 N
0
0 BA W A
30
Packing Type
0
= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
DYB Power Up, Speed Combinations
3
= 0, 54 MHz
B
= 1, 54 MHz
2
= 0, 66 MHz
A
= 1, 66 MHz
Package Modifier
A
= 1.2 mm, 8 x 11.6, 84-ball FBGA (TSB084)
Temperature Range
W = Wireless (-25°C to +85°C)
Package Type
BA = Very Thin Fine-Pitch BGA
Lead (Pb)-free Compliant Package
BF = Very Thin Fine-Pitch BGA
Lead (Pb)-free Package
Chip Contents—2
No content
pSRAM Density
No content
Process Technology
N
= 110nm MirrorBit™ Technology
Flash Density
512 = 512Mb (2x256Mb)
Device Family
S70WS= Multi-Chip Product
1.8 Volt-only Simultaneous Read/Write Burst Mode
Flash Memory Same-Die Stack
Table 2.1
S70WS512N00
MCP Configurations and Valid Combinations
Valid Combinations
0
BA, BF
W
A
2, A, 3, B
Package Marking Note:
The package marking omits the leading S from the ordering part number.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult
your local sales office to confirm availability of specific valid combinations and to check on newly
released combinations.
8
S70WS512N00 Based MCPs
S70WS512N00_00_A0 March 14, 2005
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