MAX8660BETL(2009) View Datasheet(PDF) - Maxim Integrated

Part Name

Description

MFG CO.

MAX8660BETL
(Rev.:2009)

High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications

Maxim Integrated 

High-Efficiency, Low-IQ, PMICs with Dynamic

Voltage Management for Mobile Applications

ABSOLUTE MAXIMUM RATINGS

IN, IN5, IN6, IN67, EN2, EN34, EN5, LBO, RSO, MR, SET1,

SET2, V1, V2, V3, V4, SCL, SDA,

SRAD to AGND..................................................-0.3V to +7.5V

LBF, LBR, EN1, RAMP to AGND .................-0.3V to (VIN + 0.3V)

V8 to AGND................................................-0.3V to (VIN8 + 0.3V)

V5 to AGND................................................-0.3V to (VIN5 + 0.3V)

V6, V7 to AGND........................................-0.3V to (VIN67 + 0.3V)

PV1 to PG1 ............................................................-0.3V to +7.5V

PV2 to PG2 ............................................................-0.3V to +7.5V

PV3 to PG3 ............................................................-0.3V to +7.5V

PV4 to PG4 ............................................................-0.3V to +7.5V

PV, PV1, PV2, PV3, PV4, IN8 to IN ........................-0.3V to +0.3V

LX1 Continuous RMS Current (Note 1) .................................2.3A

LX2 Continuous RMS Current (Note 1) .................................2.0A

LX3 Continuous RMS Current (Note 1) .................................2.6A

LX4 Continuous RMS Current (Note 1) .................................1.0A

PG1, PG2, PG3, PG4, EP to AGND.......................-0.6V to +0.6V

GND to AGND ......................................................-0.3V to +0.3V

All REGx Output Short-Circuit Duration......................Continuous

Continuous Power Dissipation (TA = +70°C)

40-Pin Thin QFN (derate 35.7mW/°C above +70°C).....2857mW

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Note 1: LX_ has internal clamp diodes to PG_ and PV_. Applications that forward bias these diodes must take care not to exceed

the IC’s package power-dissipation limits.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

(VIN = VIN5 = VIN67 = VIN8 = 3.6V, Figure 3, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)

PARAMETER

PV1, PV2, PV3, PV4, IN, IN8

Supply Voltage Range

IN Undervoltage-Lockout

Threshold

IN Overvoltage-Lockout

Threshold

SYMBOL

CONDITIONS

VIN

PV1, PV2, PV3, PV4, IN, and IN8 must be

connected together externally

VUVLO

VOVLO

VIN rising

VIN falling

VIN rising

VIN falling

Only V8 on (deep-sleep

power mode)

MIN TYP MAX UNITS

2.6

6.0

V

2.250 2.400 2.550

V

2.200 2.350 2.525

6.20 6.35 6.50

V

6.00 6.15 6.30

20

V1, V2, and V8 on;

V1 and V2 in normal (skip)

50

operating mode

Input Current

V1, V2, V5, and V8 on

IIN+

No load;

IPV1+IPV2+ SDA = SCL = V8

(sleep power mode);

V1 and V2 in normal (skip)

operating mode

90

IPV3+IPV4+

V1, V2, V3, V4, V5, and V8 on

µA

IIN5+

IIN67+ IIN8

(run power mode);

V1, V2, V3, and V4 in normal

140

(skip) operating mode

V1, V2, V3, V4, V5, V6, V7,

and V8 (all on);

V1, V2, V3, and V4 in normal

250

(skip) operating mode

Undervoltage lockout, VIN = 2.2V

1.5

Overvoltage lockout, VIN = 6.5V

25

4 _______________________________________________________________________________________

Share Link: