WED3EG7232S-JD3
PRELIMINARY
Document Title
256MB- 32Mx72 DDR SDRAM UNBUFFERED
DRAM DIE OPTIONS:
• SAMSUNG: H-Die
• MICRON: T26Z: G-Die
Revision History
Rev #
Rev 1
Rev 2
Rev 3
Rev 4
Rev 5
Rev 6
History
Release Date Status
Created Datasheet
Corrected Mechanical Drawing
3.1 Removed "ED" for Part Marking
3.2 Changed from Advanced to Preliminary
3-6-02
5-22-02
5-04
Advanced
Advanced
Preliminary
4.1 Added 333 and 400HMz speed
4.2 Added lead-free and RoHS notes
12-04
Preliminary
5.1 Added "ED" back to part number
5.2 Added JEDEC Standard PBC
5.3 Added "D3" package option "NOT RECOMMENDED FOR
NEW DESIGNS"
5-05
6.1 Remove "D3" package option
6.2 Added "Part Numbering Guide"
6.3 Added DRAM die options
6-06
Preliminary
Preliminary
June 2006
Rev. 6
12
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com