WED3C755E8M300BI View Datasheet(PDF) - White Electronic Designs Corporation

Part Name

Description

MFG CO.

WED3C755E8M300BI

RISC MICROPROCESSOR MULTI-CHIP PACKAGE

White Electronic Designs Corporation 

White Electronic Designs WED3C755E8M-XBX

FIG. 2 - BLOCK DIAGRAM

Completion

System Unit

Instruction

Fetch

Branch Unit

Control Unit

Dispatch

BHT/BTIC

32K ICache

FXU1 FXU2

GPRs

Rename

Buffers

LSU

FPRs

Rename

Buffers

FPU

32K DCache

L2Tags

L2 Cache

BIU

60x BIU

L2 Cache

Bus

60x Bus

SSRAM SSRAM

White Electronic Designs Corp. reserves the right to change products or specifications without notice.

May, 2003

Rev 2

2

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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