WED3C755E8M300BM View Datasheet(PDF) - White Electronic Designs Corporation

Part Name

Description

MFG CO.

WED3C755E8M300BM

RISC MICROPROCESSOR MULTI-CHIP PACKAGE

White Electronic Designs Corporation 

White Electronic Designs WED3C755E8M-XBX

Document Title

PowerPC 755 + L2 Cache Multi-Chip Package

Revision History

Rev # History

Rev 0 Initial Release

Rev 1

Changes (Pg. 1, 6, 7)

1.1 Remove 'Selects 3.3V interface' and 'Selects 2.0V interface from note 4 of pack-

age pinout listing.

1.2 Add notes 'BVSED = 0 is not available' and 'L2VSED = 0 is not available' to Rec-

ommended Operating Conditions Table

Rev 2

Changes (Pg. 1, 8, 14)

1.1 Add Thermal Resistance Table on page 8

1.2 Add Revision History as page 14

Release Date

September 2002

February 2003

Status

Final

Final

May 2003

Final

White Electronic Designs Corp. reserves the right to change products or specifications without notice.

May, 2003

Rev 2

14

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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