SO14 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

SO14

Thermal Data

STMicroelectronics 

®

Thermal Data

SO 14

14 leads

item #

PACKAGE MATERIAL LIST

material

thickness

leadframe

die attach

molding

compound

copper

epoxy glue

( silver filler )

epoxy resin

0.20 mm

10-40 µm

1.65 mm

thermal

conductivity

2.61 W/cm°C

0.01 W/cm°C

0.0063W/cm°C

Charts enclosed :

1) Rth(j-a) vs power dissipation

2) Zth(j-a) vs time width and die size

February 1998

1/2

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