Philips Semiconductors
16-bit buffer/line driver; 3-state
(3.6 V tolerant)
PACKAGE OUTLINE
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
Product specification
74AVC16244
SOT362-1
D
y
Z
48
c
25
E
A
X
HE
vM A
pin 1 index
1
e
A2
A1
24
wM
bp
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
L
Lp
Q
v
w
y
Z
θ
mm
1.2
0.15
0.05
1.05
0.85
0.25
0.28
0.17
0.2
0.1
12.6
12.4
6.2
6.0
0.5
8.3
7.9
1
0.8
0.4
0.50
0.35
0.25
0.08
0.1
0.8
0.4
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT362-1
REFERENCES
IEC
JEDEC
EIAJ
MO-153ED
EUROPEAN
PROJECTION
ISSUE DATE
93-02-03
95-02-10
1999 Nov 15
10