MAX8640YEXT24-T(2009) View Datasheet(PDF) - Maxim Integrated
Part Name
Description
MFG CO.
MAX8640YEXT24-T
(Rev.:2009)
(Rev.:2009)
Maxim Integrated
MAX8640YEXT24-T Datasheet PDF : 12 Pages
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Tiny 500mA, 4MHz/2MHz Synchronous
Step-Down DC-DC Converters
PART
MAX8640ZELT12
MAX8640ZELT13
MAX8640ZELT15
MAX8640ZELT18
OUTPUT
VOLTAGE (V)
1.2
1.3
1.5
1.8
FREQUENCY
(MHz)
3.6
3.7
3.9
4.0
Ordering Information (continued)
PART*
PIN-
PACKAGE
TOP MARK
MAX8640YEXT24+T
6 SC70
ADM
MAX8640YEXT25+T
6 SC70
ACJ
MAX8640YELT08+T
6 µDFN
NB
MAX8640YELT11+T
6 µDFN
NC
MAX8640YELT12+T
6 µDFN
ND
MAX8640YELT13+T
6 µDFN
NE
MAX8640YELT15+T
6 µDFN
NF
MAX8640YELT16+T
6 µDFN
NG
MAX8640YELT18+T
6 µDFN
NH
MAX8640YELT19+T
6 µDFN
NI
MAX8640YELT25+T
6 µDFN
NJ
MAX8640YELT82+T
6 µDFN
OW
MAX8640ZEXT08+T
6 SC70
ACL
MAX8640ZEXT11+T
MAX8640ZEXT12+T
6 SC70
6 SC70
ACM
ACN
MAX8640ZEXT13+T
MAX8640ZEXT15+T
6 SC70
6 SC70
ACO
ACP
MAX8640ZEXT18+T
6 SC70
ACU
MAX8640ZELT08+T
6 µDFN
NK
MAX8640ZELT11+T
6 µDFN
NL
MAX8640ZELT12+T
6 µDFN
NM
MAX8640ZELT13+T
6 µDFN
NN
MAX8640ZELT15+T
6 µDFN
NO
MAX8640ZELT18+T
6 µDFN
NP
*Contact factory for availability of each version. For 2.85V output
(82 version), request application note that includes limitations
and typical operating characteristics.
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
Note: All devices are specified over the -40°C to +85°C
operating temperature range.
Selector Guide (continued)
RECOMMENDED COMPONENTS
L1 (µH)
C2 (µF)
1
2.2
1
2.2
1
2.2
1
2.2
TOP MARK
NM
NN
NO
NP
typically perform well. Due to the MAX8640Y/
MAX8640Z soft-start, the input capacitance can be very
low. For optimum noise immunity and low input ripple,
choose a capacitor value in µF that is equal to or larger
than the inductor’s value in µH.
PCB Layout and Routing
High switching frequencies and large peak currents
make PCB layout a very important part of design. Good
design minimizes excessive EMI on the feedback paths
and voltage gradients in the ground plane, both of
which can result in instability or regulation errors.
Connect the inductor, input capacitor, and output
capacitor as close together as possible, and keep their
traces short, direct, and wide. Connect the two GND
pins under the IC and directly to the grounds of the
input and output capacitors. Keep noisy traces, such
as the LX node, as short as possible. Refer to the
MAX8640Z evaluation kit for an example PCB layout
and routing scheme.
PROCESS: BiCMOS
Chip Information
8 _______________________________________________________________________________________
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