Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Drain–Source Diode Characteristics and Maximum Ratings
trr
Diode Reverse Recovery Time
IF = 6.5 A, diF/dt = 100 A/µs
Qrr
Diode Reverse Recovery Charge
Min Typ Max Units
16
nS
4.3
nC
NOTES:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the
drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 68°C/W when
mounted on a 1in2 pad
of 2 oz copper (Single
Operation).
b) 102°C/W when mounted
on a minimum pad of 2 oz
copper (Single Operation).
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
3. The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied.
4. Electrical characterization and datasheet limits was based on a single source configuration (pin 2 & 5 no connection).
FDC6000NZ RevE1 (W)