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74HC4538(2008) View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
74HC4538
(Rev.:2008)
ST-Microelectronics
STMicroelectronics 
74HC4538 Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
M74HC4538
5
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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