54AC14 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

54AC14

Rad-hard advanced high-speed 5 V CMOS logic series

STMicroelectronics 

54ACxxxx, 54ACTxxxx

4

Package mechanical data

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

Figure 2. Ceramic Flat-14 package outline

F

G

D

Note:

H

14

A

1

H

8

N

L

7

E

M

B

C

016029E

The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the

package. Connecting unused pins or metal lid to ground or to the power supply will not affect

the electrical characteristics.

Table 6. Ceramic Flat-14 package mechanical data

Symbol

Min.

Dimensions (mm)

Typ.

A

6.75

6.91

B

9.76

9.95

C

1.49

D

0.10

0.127

E

7.50

7.62

F

1.27

G

0.38

0.43

H

6.0

L

18.75

M

0.38

N

4.31

Max.

7.06

10.14

1.95

0.15

7.75

0.48

22.0

Doc ID 17352 Rev 3

11/28

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