5962F9670301VXC View Datasheet(PDF) - Intersil

Part Name

Description

MFG CO.

5962F9670301VXC

Radiation Hardened Quad 2-Input NAND Gate with Open Drain

Intersil 

ACS03MS

Die Characteristics

DIE DIMENSIONS:

68 mils x 79 mils

1730mm x 2010mm

METALLIZATION:

Type: AlSi

Metal 1 Thickness: 7.125kÅ ±1.125kÅ

Metal 2 Thickness: 9kÅ ±1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 8kÅ ±1kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

110µm x 110µm

4.3 mils x 4.3 mils

Metallization Mask Layout

ACS03MS

B1

A1

VCC

B4

(2)

(1)

(14)

(13)

Y1 (3)

A2 (4)

B2 (5)

Y2 (6)

(7)

(8)

GND

Y3

3

(12) A4

(11) Y4

(10) B3

(9) A3

Spec Number 518779

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